Can CC-TLP be used as an early Failure Analysis tool?

A comprehensive study of the correlation between CDM and CC-TLP measurements was done using statistical data from CDM and CC-TLP stresses on various input receiver test circuits. The cause of failure for each test was evaluated using simulation to examine the use of CC-TLP measurements as a failure analysis tool.

Authors

Johan Bourgeat
Blaise Jacquier
Chloé Troussier

Institutions

STMicroelectronics (France) (FR)

Publication Details

Published: 2024-09-16
DOI: https://doi.org/10.23919/eos/esd61719.2024.10702149
Primary Topic: Integrated Circuits and Semiconductor Failure Analysis
Type: article
Field-Weighted Citation Impact: 0.00

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article

Can CC-TLP be used as an early Failure Analysis tool?

Johan Bourgeat, Blaise Jacquier, Chloé Troussier

Sep 16, 2024

1 links

Integrated Circuits and Semiconductor Failure Analysis

article

Can CC-TLP be used as an early Failure Analysis tool?

Johan Bourgeat, Blaise Jacquier, Chloé Troussier

September 16, 2024article en

Abstract

STMicroelectronics (France) (FR)

Openalex Percentile: Top 85%

Integrated Circuits and Semiconductor Failure Analysis

DOI Source OpenAlex

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Can CC-TLP be used as an early Failure Analysis tool? — Johan Bourgeat, Blaise Jacquier, et al. · (2024) | TGRS Research Map | TGRS