The Demand for a CDM Bare Die Testing Method

The actual CDM test does not address the risk for bare dies in production processes, e.g. D2D stacking. The actual capacitance and peak current values for bare dies cannot be simulated in the standard FICDM setup. The current CDM standard needs to be extended with alternative testing methods that can fulfill the requirements of bare dies and small devices for fast pulses beyond the actual bandwidth specification.