Consideration of waveform analysis and test methods for Charged Board Event

In recent years, destruction phenomena caused by static electricity have been increasing in semiconductor-assembled boards and modules. However, the magnitude of stress applied and the destruction phenomena differ for each board and module. This study provides the measurement results and analysis of discharge waveforms using the Charged Board Event (hereinafter referred to as CBE) tester that meets the JS-002 CDM standard. Parameters such as the size of the board mounted with module and grounding (GND) pattern on the board are varied to explore their respective influences on discharge waveforms.