FI-CDM and LICCDM testing on wafer, single die and package levels

Although not mainstream yet, Contact Charged Device Model (CDM) electrostatic discharge (ESD) testers are being used by the industry. In this paper we compare the Low-Impedance Contact CDM tester to the industry standard Field-Induced CDM tester. We test an actual IC product at wafer, bare-die and package levels.

Authors

M. Sawada
Shih‐Hung Chen (ORCID: https://orcid.org/0000-0002-6481-2951)
Yohei Shimada
D. Claes (ORCID: https://orcid.org/0000-0002-0356-0973)
Hiroshi Takenaka (ORCID: https://orcid.org/0000-0002-4702-4961)
Marko Simicic (ORCID: https://orcid.org/0000-0002-3623-1842)
Shinichi Tamura

Institutions

IMEC (BE)

Publication Details

Published: 2024-09-16
DOI: https://doi.org/10.23919/eos/esd61719.2024.10702171
Primary Topic: 3D IC and TSV technologies
Type: article
Field-Weighted Citation Impact: 0.00

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article

FI-CDM and LICCDM testing on wafer, single die and package levels

M. Sawada, Shih‐Hung Chen, Yohei Shimada, D. Claes et al.

Sep 16, 2024

3D IC and TSV technologies

article

FI-CDM and LICCDM testing on wafer, single die and package levels

M. Sawada, Shih‐Hung Chen, Yohei Shimada, D. Claes, Hiroshi Takenaka, Marko Simicic, Shinichi Tamura

September 16, 2024article en

Abstract

Although not mainstream yet, Contact Charged Device Model (CDM) electrostatic discharge (ESD) testers are being used by the industry. In this paper we compare the Low-Impedance Contact CDM tester to the industry standard Field-Induced CDM tester. We test an actual IC product at wafer, bare-die and package levels.

IMEC (BE)

Openalex Percentile: Top 85%

3D IC and TSV technologies

DOI Source OpenAlex

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