Characterization of Silver Conductive Ink Screen-Printed Textile Circuits: Effects of Substrate, Mesh Density, and Overprinting

This study explores the intricate interaction between the properties of textile substrates and screen-printing parameters in shaping fabric circuits using silver conductive ink. Via analyzing key variables such as fabric type, mesh density, and the number of overprinted layers, the research revealed how the porous structure, large surface area, and fiber morphology of textile substrates influence ink absorption, ultimately enhancing the electrical connectivity of the printed circuits. Notably, the hydrophilic cotton staple fibers fabric effectively absorbed the conductive ink into the fabric substrate, demonstrating superior electrical performance compared with the hydrophobic polyester filament fabric after three overprinting, unlike the results observed after a single print. As mesh density decreased and the number of prints increased, the electrical resistance of the circuit gradually reduced, but ink bleeding on the fabric surface became more pronounced. Cotton fabric, via absorbing the ink deeply, exhibited less surface bleeding, while polyester fabric showed more noticeable ink spreading. These findings provide valuable insights for improving screen printing technology for textile circuits and contribute to the development of advanced fabric circuits that enhance the functionality of smart wearable technology.

Authors

Institutions

Publication Details

Journal
Materials
Published
2024-10-06
DOI
https://doi.org/10.3390/ma17194898
Citations
4
Primary Topic
Advanced Sensor and Energy Harvesting Materials
Type
article
Field-Weighted Citation Impact
0.74

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Characterization of Silver Conductive Ink Screen-Printed Textile Circuits: Effects of Substrate, Mesh Density, and Overprinting

Jung‐Sim Roh, Hyobin Im
4 citations
Materials
Advanced Sensor and Energy Harvesting Materials
0.74
article

Characterization of Silver Conductive Ink Screen-Printed Textile Circuits: Effects of Substrate, Mesh Density, and Overprinting

Jung‐Sim Roh, Hyobin Im
article en
4 citations

Abstract

This study explores the intricate interaction between the properties of textile substrates and screen-printing parameters in shaping fabric circuits using silver conductive ink. Via analyzing key variables such as fabric type, mesh density, and the number of overprinted layers, the research revealed how the porous structure, large surface area, and fiber morphology of textile substrates influence ink absorption, ultimately enhancing the electrical connectivity of the printed circuits. Notably, the hydrophilic cotton staple fibers fabric effectively absorbed the conductive ink into the fabric substrate, demonstrating superior electrical performance compared with the hydrophobic polyester filament fabric after three overprinting, unlike the results observed after a single print. As mesh density decreased and the number of prints increased, the electrical resistance of the circuit gradually reduced, but ink bleeding on the fabric surface became more pronounced. Cotton fabric, via absorbing the ink deeply, exhibited less surface bleeding, while polyester fabric showed more noticeable ink spreading. These findings provide valuable insights for improving screen printing technology for textile circuits and contribute to the development of advanced fabric circuits that enhance the functionality of smart wearable technology.

MaterialsVol. 17(19)
Sangmyung University (KR)
National Research Foundation of Korea
Openalex Percentile: Top 32%
Advanced Sensor and Energy Harvesting Materials
0.74
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.