An In Situ Automated System for Real-Time Monitoring of Failures in Large-Scale Field Emitter Arrays

Nano-scale vacuum transistors (NVCTs) based on field emission have the potential to operate at high frequencies and withstand harsh environments, such as radiation, high temperatures, and high power. However, they have demonstrated instability and failures over time. To achieve high currents from NVCTs, these devices are typically fabricated in large-scale arrays known as field emitter arrays (FEAs), which share a common gate, cathode, and anode. Consequently, the measured currents come from the entire array, providing limited information about the emission characteristics of individual tips. Arrays can exhibit nonuniform emission behavior across the emitting area. A phosphor screen can be used to monitor the emission pattern of the array. Additionally, visible damage can occur on the surface of the FEAs, potentially leading to the destruction of the gate and emitters, causing catastrophic failure of the FEAs. To monitor damage while operating the device, an ITO-coated glass anode, which is electrically conductive and visible-light-transparent, can be used. In this work, a method was developed to automatically monitor the emission pattern of the emitters and the changes in surface morphology while operating the devices and collecting electrical data, providing real-time information on the failure sequence of the FEAs.

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Publication Details

Journal
Instruments
Published
2024-10-06
DOI
https://doi.org/10.3390/instruments8040044
Citations
1
Primary Topic
VLSI and Analog Circuit Testing
Type
article
Field-Weighted Citation Impact
0.49

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An In Situ Automated System for Real-Time Monitoring of Failures in Large-Scale Field Emitter Arrays

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1 citations
Instruments
VLSI and Analog Circuit Testing
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article

An In Situ Automated System for Real-Time Monitoring of Failures in Large-Scale Field Emitter Arrays

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article en
1 citations

Abstract

Nano-scale vacuum transistors (NVCTs) based on field emission have the potential to operate at high frequencies and withstand harsh environments, such as radiation, high temperatures, and high power. However, they have demonstrated instability and failures over time. To achieve high currents from NVCTs, these devices are typically fabricated in large-scale arrays known as field emitter arrays (FEAs), which share a common gate, cathode, and anode. Consequently, the measured currents come from the entire array, providing limited information about the emission characteristics of individual tips. Arrays can exhibit nonuniform emission behavior across the emitting area. A phosphor screen can be used to monitor the emission pattern of the array. Additionally, visible damage can occur on the surface of the FEAs, potentially leading to the destruction of the gate and emitters, causing catastrophic failure of the FEAs. To monitor damage while operating the device, an ITO-coated glass anode, which is electrically conductive and visible-light-transparent, can be used. In this work, a method was developed to automatically monitor the emission pattern of the emitters and the changes in surface morphology while operating the devices and collecting electrical data, providing real-time information on the failure sequence of the FEAs.

InstrumentsVol. 8(4)
The University of Texas at Dallas (US), Southern Methodist University (US), Coherent (United States) (US)
Air Force Office of Scientific Research
Affordable and clean energy
Openalex Percentile: Top 37%
VLSI and Analog Circuit Testing
0.49
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An In Situ Automated System for Real-Time Monitoring of Failures in Large-Scale Field Emitter Arrays — Han Gao, Reza Farsad Asadi, et al. · Instruments (2024) | TGRS Research Map | TGRS