Investigation of In Situ NH<sub>3</sub> and N<sub>2</sub>O Plasma Treatment on AlGaN/GaN High Electron Mobility Transistors
Plasma pre-treatment using NH 3 and N 2 O gases was conducted prior to deposition of a SiN passivation layer to compare and analyze the impact of each plasma gas on the device characteristics of AlGaN/GaN high electron mobility transistors (HEMTs).Surface analyses were performed through atomic force microscopy, X-ray photoelectron spectroscopy (XPS), and transmission electron microscopy.A systematic investigation confirmed improvements in surface quality, with the most significant enhancement observed after NH 3 plasma treatment.In particular, XPS analysis provided insights into these improvements, highlighting the effective oxide removal capability of NH 3 plasma.Additionally, direct current and frequency dispersion analyses through capacitance measurements confirmed that the device characteristics were enhanced after plasma treatment.The plasma treatment using NH 3 gas thus was very effective for improving the surface quality in AlGaN/GaN HEMTs.
Authors
- Ilgyu Choi (ORCID: https://orcid.org/0000-0002-5566-3050)
- Dohyun Kim (ORCID: https://orcid.org/0009-0002-7347-7398)
- Hyun‐Wook Jung (ORCID: https://orcid.org/0000-0001-5770-6387)
- Sung‐Jae Chang (ORCID: https://orcid.org/0000-0002-6973-8199)
- Hyun Seok Lee (ORCID: https://orcid.org/0000-0002-6669-5883)
- Ho‐Kyun Ahn (ORCID: https://orcid.org/0000-0003-3937-8257)
Institutions
- Electronics and Telecommunications Research Institute (KR)
- Chungbuk National University (KR)
Publication Details
- Journal
- Applied Science and Convergence Technology
- Published
- 2024-09-30
- DOI
- https://doi.org/10.5757/asct.2024.33.5.152
- Citations
- 3
- Primary Topic
- GaN-based semiconductor devices and materials
- Type
- article
- Field-Weighted Citation Impact
- 0.93
Funders
- Agency for Defense Development
- Defense Acquisition Program Administration