Investigation of In Situ NH<sub>3</sub> and N<sub>2</sub>O Plasma Treatment on AlGaN/GaN High Electron Mobility Transistors

Plasma pre-treatment using NH 3 and N 2 O gases was conducted prior to deposition of a SiN passivation layer to compare and analyze the impact of each plasma gas on the device characteristics of AlGaN/GaN high electron mobility transistors (HEMTs).Surface analyses were performed through atomic force microscopy, X-ray photoelectron spectroscopy (XPS), and transmission electron microscopy.A systematic investigation confirmed improvements in surface quality, with the most significant enhancement observed after NH 3 plasma treatment.In particular, XPS analysis provided insights into these improvements, highlighting the effective oxide removal capability of NH 3 plasma.Additionally, direct current and frequency dispersion analyses through capacitance measurements confirmed that the device characteristics were enhanced after plasma treatment.The plasma treatment using NH 3 gas thus was very effective for improving the surface quality in AlGaN/GaN HEMTs.

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Publication Details

Journal
Applied Science and Convergence Technology
Published
2024-09-30
DOI
https://doi.org/10.5757/asct.2024.33.5.152
Citations
3
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.93

Funders

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article

Investigation of In Situ NH3 and N2O Plasma Treatment on AlGaN/GaN High Electron Mobility Transistors

Ilgyu Choi, Dohyun Kim, Hyun‐Wook Jung, Sung‐Jae Chang et al.
3 citations
Applied Science and Convergence Technology
GaN-based semiconductor devices and materials
0.93
article

Investigation of In Situ NH3 and N2O Plasma Treatment on AlGaN/GaN High Electron Mobility Transistors

Ilgyu Choi, Dohyun Kim, Hyun‐Wook Jung, Sung‐Jae Chang, Hyun Seok Lee, Ho‐Kyun Ahn
article en
3 citations

Abstract

Plasma pre-treatment using NH 3 and N 2 O gases was conducted prior to deposition of a SiN passivation layer to compare and analyze the impact of each plasma gas on the device characteristics of AlGaN/GaN high electron mobility transistors (HEMTs).Surface analyses were performed through atomic force microscopy, X-ray photoelectron spectroscopy (XPS), and transmission electron microscopy.A systematic investigation confirmed improvements in surface quality, with the most significant enhancement observed after NH 3 plasma treatment.In particular, XPS analysis provided insights into these improvements, highlighting the effective oxide removal capability of NH 3 plasma.Additionally, direct current and frequency dispersion analyses through capacitance measurements confirmed that the device characteristics were enhanced after plasma treatment.The plasma treatment using NH 3 gas thus was very effective for improving the surface quality in AlGaN/GaN HEMTs.

Applied Science and Convergence TechnologyVol. 33(5)
Electronics and Telecommunications Research Institute (KR), Chungbuk National University (KR)
Agency for Defense Development, Defense Acquisition Program Administration
Affordable and clean energy
Openalex Percentile: Top 26%
GaN-based semiconductor devices and materials
0.93
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