Enhancing directional thermal conductivity in hexagonal boron nitride reinforced epoxy composites through robust interfacial bonding

Abstract Establishing a robust interfacial bond between hexagonal boron nitride (h‐BN) plates and the epoxy matrix is essential for enhancing heat transfer, which is difficult because of h‐BN's low‐surface energy, tendency to clump together, and the chemical inertness of the epoxy matrix. This research shows different techniques for treating the surface of h‐BN fillers by applying acids and thermal processes to activate the surface. The silanization process was used to increase the silane content on the surface of activated h‐BN in order to make it more compatible with the epoxy matrix. X‐ray photoelectron spectroscopy analysis revealed silicon peaks (Si 2 s peak at 150.1 eV and Si 2 p peak at 100.3 eV) in the spectrum of silane‐treated samples. Heat treatment resulted in the production of more oxygen molecules on the shell of h‐BN compared to the acid treatment. Here, the primary focus was on examining how surface treatment affects thermal conductivity (TC) performance in both in‐plane and through‐thickness paths. There was an increase in the epoxy's TC perpendicular to the plane, going from 0.21 to 0.47 (W/mK), showing a remarkable 123.8% enhancement by adding 10 wt% of silane‐modified‐thermal treated h‐BN particles. The improvement resulted from effectively silanizing the exterior boundary of h‐BN particles, enhancing connection and distribution in the epoxy matrix. Surface modification of h‐BN‐epoxy composites improves TC, leading to better heat conduction in thermal management systems, benefiting industries like aerospace, automotive, and energy systems. Highlights Silanization of h‐BN for better filler‐matrix bonding leading to improved heat transfer Boosting thermal conductivity in the through‐thickness direction with surface‐modified h‐BN Significant improvement in through‐thickness thermal conductivity with treated h‐BN. Thermal treatment of h‐BN produced better oxygenation than acid treatment. Application in aerospace and automotive through improved heat transfer.

Authors

Institutions

Publication Details

Journal
Polymer Composites
Published
2024-10-06
DOI
https://doi.org/10.1002/pc.29136
Citations
29
Primary Topic
Thermal properties of materials
Type
article
Field-Weighted Citation Impact
3.40
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Enhancing directional thermal conductivity in hexagonal boron nitride reinforced epoxy composites through robust interfacial bonding

Cennet Yıldırım, Semih Doğan, Bertan Beylergi̇l, Kuray Dericiler et al.
29 citations
Polymer Composites
Thermal properties of materials
3.40
article

Enhancing directional thermal conductivity in hexagonal boron nitride reinforced epoxy composites through robust interfacial bonding

Cennet Yıldırım, Semih Doğan, Bertan Beylergi̇l, Kuray Dericiler, Burcu Saner Okan, Marjan Hezarkhani, Mostafa Mehdipour, Muhammet Nasuh Arık, Mehmet Yıldız
article en
29 citations

Abstract

Abstract Establishing a robust interfacial bond between hexagonal boron nitride (h‐BN) plates and the epoxy matrix is essential for enhancing heat transfer, which is difficult because of h‐BN's low‐surface energy, tendency to clump together, and the chemical inertness of the epoxy matrix. This research shows different techniques for treating the surface of h‐BN fillers by applying acids and thermal processes to activate the surface. The silanization process was used to increase the silane content on the surface of activated h‐BN in order to make it more compatible with the epoxy matrix. X‐ray photoelectron spectroscopy analysis revealed silicon peaks (Si 2 s peak at 150.1 eV and Si 2 p peak at 100.3 eV) in the spectrum of silane‐treated samples. Heat treatment resulted in the production of more oxygen molecules on the shell of h‐BN compared to the acid treatment. Here, the primary focus was on examining how surface treatment affects thermal conductivity (TC) performance in both in‐plane and through‐thickness paths. There was an increase in the epoxy's TC perpendicular to the plane, going from 0.21 to 0.47 (W/mK), showing a remarkable 123.8% enhancement by adding 10 wt% of silane‐modified‐thermal treated h‐BN particles. The improvement resulted from effectively silanizing the exterior boundary of h‐BN particles, enhancing connection and distribution in the epoxy matrix. Surface modification of h‐BN‐epoxy composites improves TC, leading to better heat conduction in thermal management systems, benefiting industries like aerospace, automotive, and energy systems. Highlights Silanization of h‐BN for better filler‐matrix bonding leading to improved heat transfer Boosting thermal conductivity in the through‐thickness direction with surface‐modified h‐BN Significant improvement in through‐thickness thermal conductivity with treated h‐BN. Thermal treatment of h‐BN produced better oxygenation than acid treatment. Application in aerospace and automotive through improved heat transfer.

Polymer CompositesVol. 46(3)
Sabancı Üniversitesi (TR), Alanya University (TR), National Boron Research Institute (TR), Alanya Alaaddin Keykubat Üniversitesi (TR)
Affordable and clean energy
Openalex Percentile: Top 4%
Thermal properties of materials
3.40
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.