Maillard Type Reaction for Electroless Copper Plating onto Ceramic Nanoparticles

A high demand for oxide dispersion strengthened (ODS) materials arose in wide fields of application. The electroless plating method has been presented as an elegant way to overcome different surface energies and obtain metal‐plated ceramics. However, copper electroless plating is still performed under harsh conditions with toxic and expensive reagents, including noble metals and harsh reducing agents like formaldehyde and hydrazine. To create a pure copper metal matrix in an environmentally friendly and efficient way a previously reported method is advanced in a way that naturally occurring amino acids are utilized. A screening of several amino acids leads to an improvement in phase purity and atomic efficiency. Therefore, a Maillard type reaction with lysine as amino compound is reported to show the best results in the particle coating for all ceramic nanoparticles evaluated. The metal plating results in uniform round micro particles showing a homogeneous coating. In order to obtain copper matrix composites, the prepared particles are successfully implemented in a PBF‐LB/M process after mixing with a highly conductive copper alloy. The resulting products were investigated by transmission electron microscopy, scanning electron microscopy, powder X‐ray diffraction, and optical density measurements.