Effects of hydrogen bonding and cross-linking on thermal conductivity of amorphous epoxy network

The thermal conductivities of different epoxy resin formulations are investigated with two different measurement methods. Special attention is given to the concentration of H-atoms bonded to N- or O-atoms and the crosslink density. To investigate the influence of these variables independently, the stoichiometry of the resin formulation is varied. If the significant variables are separated a linear correlation can be observed with the thermal conductivity. A higher crosslink density and a higher concentration of H-atoms bonded to N- or O-atoms lead to a higher thermal conductivity. H-atoms bonded to O-atoms lead to a higher thermal conductivity then H-atoms bonded to N-atoms. • Functional groups that can form H-bonds increase the thermal conductivity. • Increasing crosslink density leads to higher thermal conductivity. • Different influences on the thermal conductivity can cancel each other out. • A higher mass density leads to a higher thermal conductivity.