Investigation of the Bending Process and Theory in Free-Boundary Pneumatic Film-Forming for Curved Image Sensors

To explore the bending process and theory of the free-boundary aerodynamic film forming method for curved detectors, this study integrates practical forming structures with theoretical analysis and establishes a simulation model to investigate stress, strain, and morphological changes during bending. The analysis indicates that the shift from "projection" to "wrapping" in forming theory is due to the release of boundary degrees of freedom. The forming process can be summarized as the mold's arc characteristics, originating from the chip's corners, gradually replacing the chip's rectangular characteristics along the diagonal, resulting in corresponding stress and strain changes. The "wrapping" bending theory of this method has significant advantages over traditional methods and represents a crucial direction for achieving higher curvature in the future. However, this study found that the use of film pressure can only inhibit out-of-plane deformation to a certain extent, and the buckling phenomenon will still occur when the thinner chip is bent. It prevents the use of thinner chips in the thinning-bending method, so avoiding out-of-plane deformation during the molding process is the direction that needs to be broken in the future.