Multi-chip Microwave Module Micro-assembly Flexible Automatic Connection

To meet the growing demand for micro-assembly production of microwave products, a flexible micro-assembly automation line has been developed. Equipment layout and track transmission design were carried out to meet the requirements of flexible production. In response to the differences in track height and width of standard automatic equipment for each process of micro-assembly, as well as the different communication protocols of each device, the hardware and software of each type of equipment were uniformly modified to overcome the differences in track height and width between devices, achieve information exchange between devices and tracks, and ultimately achieve successful interconnection of hardware and software between devices. This flexible automated micro-assembly line can achieve the full process production of micro-assembly from bonding and feeding to automatic bonding, with a 400% increase in personnel utilization and a 100% increase in production efficiency.

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Publication Details

Published
2024-08-16
DOI
https://doi.org/10.1109/aces-china62474.2024.10699862
Primary Topic
Semiconductor Lasers and Optical Devices
Type
article
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Multi-chip Microwave Module Micro-assembly Flexible Automatic Connection

Na Li
Semiconductor Lasers and Optical Devices
article

Multi-chip Microwave Module Micro-assembly Flexible Automatic Connection

Na Li
article en

Abstract

To meet the growing demand for micro-assembly production of microwave products, a flexible micro-assembly automation line has been developed. Equipment layout and track transmission design were carried out to meet the requirements of flexible production. In response to the differences in track height and width of standard automatic equipment for each process of micro-assembly, as well as the different communication protocols of each device, the hardware and software of each type of equipment were uniformly modified to overcome the differences in track height and width between devices, achieve information exchange between devices and tracks, and ultimately achieve successful interconnection of hardware and software between devices. This flexible automated micro-assembly line can achieve the full process production of micro-assembly from bonding and feeding to automatic bonding, with a 400% increase in personnel utilization and a 100% increase in production efficiency.

Affordable and clean energy
Openalex Percentile: Top 85%
Semiconductor Lasers and Optical Devices
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