Thermal Cycling Reliability Analysis of 2.5D Chiplet Based on Silicon Interposer

As an important technology in the post-Moore era, Chiplet has been widely used in system design. In this work, the thermal cycling reliability of 2.5D Chiplet based on silicon (Si) interposer is investigated. First, a quarter 2.5D Chiplet thermal simulation model is established. Secondly, we found radial deformation distribution patterns for die, Si interposer and bump arrays. The maximum warpage occurs at the corners of Si interposer. The stresses in each bump are concentrated at the two ends, which are more prone to cracking. Finally, as the thickness of the Si interposer increases, the stress on it decreases, however, the deformation first decreases and then increases slightly.