An Integrated Microsystem Electromagnetic Protection Scheme Based on Resistor-Embedded Spoof Surface Plasmon Polariton Structure

Electromagnetic interference (EMI) always affects the normal operation of integrated microsystems. With the continuous development of modern electronic technology, the size of chips and circuit systems is constantly shrinking, and the working frequency band is increasing, which brings some trouble to electromagnetic protection. In order to solve these problems, a compact spoof surface plasmon polariton (SSPP) absorbing structure is proposed. This structure binds electromagnetic waves to the metal surface, and then reduces the intensity of electromagnetic waves through resistance, so as to achieve the purpose of electromagnetic protection. The SSPP structure is used for chip-level electromagnetic protection, which has high requirements for size, and the length and width of the structure are 2λ<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</inf>, and the thickness is 0.004 λ<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</inf> (λ<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</inf> is the minimum wavelength in the operating frequency band), which is suitable for most situations. The working frequency band of the structure is 3-12GHz, the relative absorption bandwidth is 89%, and the working bandwidth of the absorption rate is more than 90% is 4.6-12GHz, which achieves an effective electromagnetic protection effect.