High Performance 3D Integrated Common-Mode Noise Suppression Filter

In this paper, a three-dimensional (3D) common mode (CM) noise suppression filter based on through-silicon via (TSV) technology is proposed. The Chebyshev low-pass filter is used to equate the signal transmission channels. The inductors are realized by TSV technology and the proposed common-mode noise suppression filter is verified by HFSS software. The results demonstrate that the filter is capable of suppressing common-mode noise more than 10dB across the frequency range of 3.3GHz to 11.8GHz, with a fractional bandwidth (FBW) of 112.6%. Meanwhile, the differential signal insertion loss is kept less than 3dB and the bandwidth reaches 17.8GHz. In addition, the size of the common-mode noise suppression filter is only 250×430μm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> (0.0063× 0.011 λg<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>).