Thermal characterization of vertical interface by scanning photothermal radiometry
In this work, scanning photothermal radiometry is used for imaging and to characterize a submicron crack. From the thermal images, the evolution of the crack is mapped in the space with micrometer resolution. A vertical contact interface at the steel-steel junction is used to represent a micro-crack with a thickness less than 0.5 μm. The thermal quadrupole approach is used to model the heat transfer within the semi-infinite vertical crack. Then, using the phase mapping and that calculated from the model, the estimation of both the equivalent thermal boundary resistance of the interface and the average interface thickness was done.
Authors
- Matthieu Museau (ORCID: https://orcid.org/0000-0002-4235-5331)
- Andrzej Kusiak (ORCID: https://orcid.org/0000-0002-1931-7230)
- Alejandro Mateos-Canseco (ORCID: https://orcid.org/0000-0003-4670-302X)
- François Villeneuve (ORCID: https://orcid.org/0000-0002-9040-7634)
- Jean‐Luc Battaglia (ORCID: https://orcid.org/0000-0003-1176-5714)
Institutions
- Institut polytechnique de Grenoble (FR)
- Centre National de la Recherche Scientifique (FR)
- Arts et Métiers (FR)
- Laboratoire des Sciences pour la Conception, l'Optimisation et la Production (FR)
- Institut de Mécanique et d'Ingénierie de Bordeaux (FR)
- HESAM Université (FR)
- Institut Polytechnique de Bordeaux (FR)
- Université Grenoble Alpes (FR)
Publication Details
- Journal
- Review of Scientific Instruments
- Published
- 2024-10-01
- DOI
- https://doi.org/10.1063/5.0225690
- Citations
- 3
- Primary Topic
- Thermography and Photoacoustic Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.81
Funders
- Université de Bordeaux