Chip‐Scale Dispersion Compensation of High‐Speed Data – Recent Progress and Future Perspectives

Abstract High‐speed data movement in data center communications and telecommunications is the cornerstone of society's connectivity. It serves as a critical driver of economic activity, social networks, and education. Complementary metal‐oxide semiconductor compatible silicon‐based photonic integrated circuits have proliferated transceiver technology, owing to their ease of integration with application‐specific integrated circuits and mass manufacturability. Fiber impairments in the transmission of high‐speed data stem from both optical attenuation and optical dispersion. As data rates scale and modulation formats advance, the impact of fiber dispersion even at shorter reaches becomes more important to address. In this review article, recent advancements made in integrated, chip‐scale dispersion compensation solutions are covered. The focus on chip‐scale devices stems from their ability to be easily integrated within the transmitter or receiver chip of transceivers. Future perspectives on how these devices may become commonplace within transceivers and their potential impact are discussed.