Substituent Effect on Regium Bonding in Copper(II) Complexes of 4-Substituted Pyridines: Crystallographic and Computational Study

Regium bonding (also called coinage or noble bond) is an attractive weak interaction between the electrophilic region of the regium atom (group 11 element: Rg = Cu, Ag, or Au) and a nucleophilic (Nu) area of the same (intramolecular) or another (intermolecular) molecular entity. The strengths of regium bonding at Rg···Nu depend on the nature of both interacting patterns and electron-donating or -withdrawing character of substituents at Rg and Nu. Experimental and computational studies show that the strengths of Cu···Nu (Nu = Cl or Br) intermolecular regium bonds between the [Cu(Nu)2(4-substituted pyridine)2] tectons can be regulated by the replacement of substituents (−OCH3, −CH3, −H, −Cl, −CONH2, −COOCH3, or −CN) at the para- position of the pyridine ligand. However, due to the involvement of these substituents in various sorts of weak interactions, there is no linear correlation between Hammett’s para-substituent constant (σp) and the Cu···Nu distance of regium bonding.

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Publication Details

Journal
Crystal Growth & Design
Published
2024-10-03
DOI
https://doi.org/10.1021/acs.cgd.4c01124
Citations
3
Primary Topic
Metal complexes synthesis and properties
Type
article
Field-Weighted Citation Impact
0.85

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article

Substituent Effect on Regium Bonding in Copper(II) Complexes of 4-Substituted Pyridines: Crystallographic and Computational Study

Giuseppe Resnati, Rosa M. Gomila, Atash V. Gurbanov, Vusala A. Aliyeva et al.
3 citations
Crystal Growth & Design
Metal complexes synthesis and properties
0.85
article

Substituent Effect on Regium Bonding in Copper(II) Complexes of 4-Substituted Pyridines: Crystallographic and Computational Study

Giuseppe Resnati, Rosa M. Gomila, Atash V. Gurbanov, Vusala A. Aliyeva, Antonio Frontera, Vânia André, Kamran T. Mahmudov⧫, Luísa M. D. R. S. Martins
article en
3 citations

Abstract

Regium bonding (also called coinage or noble bond) is an attractive weak interaction between the electrophilic region of the regium atom (group 11 element: Rg = Cu, Ag, or Au) and a nucleophilic (Nu) area of the same (intramolecular) or another (intermolecular) molecular entity. The strengths of regium bonding at Rg···Nu depend on the nature of both interacting patterns and electron-donating or -withdrawing character of substituents at Rg and Nu. Experimental and computational studies show that the strengths of Cu···Nu (Nu = Cl or Br) intermolecular regium bonds between the [Cu(Nu)2(4-substituted pyridine)2] tectons can be regulated by the replacement of substituents (−OCH3, −CH3, −H, −Cl, −CONH2, −COOCH3, or −CN) at the para- position of the pyridine ligand. However, due to the involvement of these substituents in various sorts of weak interactions, there is no linear correlation between Hammett’s para-substituent constant (σp) and the Cu···Nu distance of regium bonding.

Crystal Growth & Design
University of Lisbon (PT), Baku State University (AZ), Universidade Politécnica de Lisboa (PT), Western Caspian University (AZ), Baku Engineering University (AZ), Universitat de les Illes Balears (ES), Politecnico di Milano (IT)
Alexander von Humboldt-Stiftung, Ministerio de Ciencia, Innovación y Universidades, Baki Dövlət Universiteti, Centro de Química Estrutural, Fundação para a Ciência e a Tecnologia, Instituto Superior Técnico
Openalex Percentile: Top 22%
Metal complexes synthesis and properties
0.85
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