Self‐Adhesive Electronic Skin with Bio‐Inspired 3D Architecture for Mechanical Stimuli Monitoring and Human‐Machine Interactions
Recent development of wearable devices is revolutionizing the way of artificial electronic skins (E-skin), physiological health monitoring and human-machine interactions (HMI). However, challenge remains to fit flexible electronic devices to the human skin with conformal deformation and identifiable electrical feedback according to the mechanical stimuli. Herein, an adhesive E-skin is developed that can firmly attach on the human skin for mechanical stimuli perception. The laser-induced adhesive layer serves as the essential component to ensure the conformal attachment of E-skin on curved surface, which ensures the accurate conversion from mechanical deformation to precise electrical readouts. Especially, the 3D architecture facilitates the non-overlapping outputs that bi-directional joint bending and distinguishes strain/pressure. The optimized E-skin with bio-inspired micro-cilia exhibited significantly improved sensing performances with sensitivity of 0.652 kPa<sup>-1</sup> in 0-4 kPa and gauge factor of 8.13 for strain (0-15%) with robustness. Furthermore, the adhesive E-skin can distinguish inward/outward joint bending in non-overlapping behaviors, allowing the establishment of ternary system to expand communication capacity for logic outputs such as effective Morse code and intelligent control. It expects that the adhesive E-skin can serve as a functional bridge between human and electrical terminals for applications from daily mechanical monitoring to efficient HMI.
Authors
- Bingpu Zhou (ORCID: https://orcid.org/0000-0003-4866-3105)
- Dan Fang
- Biao Qi (ORCID: https://orcid.org/0000-0002-4047-6199)
- Wenxue Dai (ORCID: https://orcid.org/0000-0003-1808-388X)
- Sen Ding (ORCID: https://orcid.org/0009-0007-1568-3296)
- Fangcheng Wang (ORCID: https://orcid.org/0000-0002-8603-2147)
- Guoping Zhang (ORCID: https://orcid.org/0000-0002-0683-495X)
- Ziyi Dai
- Ming Lei (ORCID: https://orcid.org/0000-0003-0875-5224)
- Rongmei Wang
Institutions
- Shandong University (CN)
- Chinese Academy of Sciences (CN)
- University of Macau (MO)
- Shenzhen Institutes of Advanced Technology (CN)
Publication Details
- Journal
- Small
- Published
- 2024-10-02
- DOI
- https://doi.org/10.1002/smll.202406564
- Citations
- 23
- Primary Topic
- Advanced Sensor and Energy Harvesting Materials
- Type
- article
- Field-Weighted Citation Impact
- 4.24
Funders
- National Natural Science Foundation of China
- Natural Science Foundation of Guangdong Province