Heterogeneous integration of active photonic materials leveraging substrate-inverted multimaterial integration technology (SuMMIT)

Heterogeneous integration of new materials promises to significantly expand the range of capabilities accessible by silicon photonic integrated circuits (PICs). However, the classical integration protocols, which involves etching trenches through the backend-of-the-line (BEOL) layers to access the PIC for subsequent material bonding or deposition, face severe limitations in integration capacity, packaging density, and process complexity. Moreover, the inability to utilize the BEOL layers is a major missed opportunity for innovative 2.5-D photonic device designs. In this talk, we will unveil a new, universal heterogeneous integration platform: Substrate-inverted Multi-Material Integration Technology (SuMMIT). The SuMMIT integration scheme leverages advanced wafer-scale 3-D packaging technologies such as through-Si vias and direct bond interconnects to enable seamless integration of non-CMOS materials.