Rethinking wire electrical discharge machining: A case for engineering thick wires to enhance performance

The widespread application of wire electrical discharge machining (WEDM) continues to be impeded by its low cutting rate, which in large part stems from constraints related to wire failure. This research therefore explored the implications of utilizing wires thicker than the industry-standard 0.25 mm diameter wire. Given that modern WEDM machines are limited to a maximum wire diameter of only 0.4 mm, a combination of numerical and experimental approaches was adopted to compute the optimal wire diameter in consideration of the competing influences of higher machining power and larger kerf width associated with thicker wires, and to project the corresponding cutting rates. The research offers new insights into phenomena underlying wire break, and underscores the significant prospects towards enhancing process performance by re-examining WEDM in terms of thick wires. • Application of wires thicker than that used in conventional wire-EDM is explored. • Wire diameter is optimized by considering volumetric removal rate and kerf width. • Wire diameter optimization entailed models for wire failure and removal rate. • Fundamental insights into phenomena underlying wire break are revealed. • Thicker wires are projected to correspond to a manyfold increase in cutting rate.