Modeling of Fabrication Errors Caused by Operator Habits in Substrate Alignment Process

Substrate alignment is an important topic in the micro fabrication technology to guarantee the development of secure micro-structured devices. There often exists an alignment error due to operator habits in the alignment process. Here, we modeled such error with the normal distribution, and the suggested model was validated by means of QQ plots and Shapiro-Wilk test. In addition, we pointed that the error in the alignment process would be reduced via calibration with statistically extracted properties of the error model. Our investigation therefore contributes to secure devices developed with the micro fabrication technology.