Optimising Electroless Copper Plating Parameters on Insulative Substrate for Enhanced Efficiency and Quality

The operating parameters of electroless copper plating significantly dictate the deposition rate and the quality of the metal layer deposited on the substrate surface. This study investigates the impact of pH and temperature on electroless copper plating on an insulative substrate, pioneering a departure from the conventional metal-based substrate. Varied pH levels (12, 12.5, 13) at a constant 70°C and adjusted temperatures (60°C, 70°C, 80°C) using the optimal pH were explored. Optimal conditions were found to be a pH of 12.5 and 70°C, yielding a deposition rate of 0.758 mg/hr and a surface roughness of 0.422 nm. Despite a 17.34% reduction in deposition rate compared to 60°C, 70°C offered superior surface coverage and minimised roughness. X-ray diffraction (XRD) confirmed high copper purity and minimal oxide presence at 70°C. Nanoindentation revealed peak hardness (1.173 GPa) and low elastic modulus (13.35 GPa) at this temperature, reflecting a compact copper grain structure. These findings establish an optimum parameter set for efficient electroless copper plating on a non-metal substrate, enhancing both process efficacy and reliability.