The Lattice Strain Distribution in Ge<sub>x</sub>Sn<sub>1-x</sub> Micro-Disks Investigated at the Sub 100-nm Scale
Experimental assessment of the strain tensor within a microstructure is challenging, especially for small mechanical deformations acting over submicron length scales. In this work, we fully characterize the spatial strain distribution within a suspended micro-disk laser made of Ge1-xSnx alloy, with fine resolution <200 nm. We employ Scanning X-ray Diffraction Microscopy, a model-free method based on synchrotron radiation, to directly obtain maps of all components of lattice strain and rotation, including the shear strains, finding them on a magnitude ~10-3. We correlate these small elastic deformations to structural defects and the relaxation of the three-dimensional microstructure, demonstrating the potential of an advanced X-ray microscopy technique for microelectronics.
Authors
- Davide Spirito (ORCID: https://orcid.org/0000-0002-6074-957X)
- Agnieszka Anna Corley‐Wiciak (ORCID: https://orcid.org/0000-0003-0974-1190)
- Carsten Richter (ORCID: https://orcid.org/0000-0002-4230-215X)
- Dan Buca (ORCID: https://orcid.org/0000-0002-3692-5596)
- Edoardo Zatterin (ORCID: https://orcid.org/0000-0001-9691-5333)
- Cedric Corley‐Wiciak (ORCID: https://orcid.org/0000-0002-0179-2957)
- Anna Marzegalli (ORCID: https://orcid.org/0000-0003-3109-3353)
- Fabrizio Rovaris (ORCID: https://orcid.org/0000-0002-0729-5409)
- Giuseppe Nicotra (ORCID: https://orcid.org/0000-0002-7336-4898)
- Tobias Urs Schülli (ORCID: https://orcid.org/0000-0002-4523-0841)
- Nils von den Driesch (ORCID: https://orcid.org/0000-0003-0169-6110)
- Francesco Montalenti (ORCID: https://orcid.org/0000-0001-7854-8269)
- Costanza Lucia Manganelli (ORCID: https://orcid.org/0000-0002-4218-2872)
- Marvin Zöllner (ORCID: https://orcid.org/0000-0001-7204-1096)
- Giovanni Capellini (ORCID: https://orcid.org/0000-0002-5169-2823)
- Gianfranco Sfruncia
- Ignati Zaitsev
Publication Details
- Journal
- ECS Transactions
- Published
- 2024-09-27
- DOI
- https://doi.org/10.1149/11402.0145ecst
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00