Enhanced Stability Under Positive Bias Temperature Stress in Oxide Thin Film Transistors with Double Gate Structure By Improving Bottom Channel Interface

In this paper, we discuss the causes of reliability degradation in oxide TFTs with a double gate structure and propose methods for improvement. Reducing IGZO deposition power significantly improves PBTS (Positive Bias Temperature Stability) reliability in double gate structures. This improvement is attributed to reduction of excess oxygen defects accumulated at the bottom channel interface, as inferred from the difference in PBTS results for the top single gate and double gate structures

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Publication Details

Journal
ECS Transactions
Published
2024-09-27
DOI
https://doi.org/10.1149/11403.0021ecst
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
0.00
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article

Enhanced Stability Under Positive Bias Temperature Stress in Oxide Thin Film Transistors with Double Gate Structure By Improving Bottom Channel Interface

Myoeng-Ho Kim, Kyoung‐Seok Son, Sunhee Lee, Jaybum Kim et al.
ECS Transactions
Semiconductor materials and devices
article

Enhanced Stability Under Positive Bias Temperature Stress in Oxide Thin Film Transistors with Double Gate Structure By Improving Bottom Channel Interface

Myoeng-Ho Kim, Kyoung‐Seok Son, Sunhee Lee, Jaybum Kim, Seunghun Lee, Youn-Goo Kim
article en

Abstract

In this paper, we discuss the causes of reliability degradation in oxide TFTs with a double gate structure and propose methods for improvement. Reducing IGZO deposition power significantly improves PBTS (Positive Bias Temperature Stability) reliability in double gate structures. This improvement is attributed to reduction of excess oxygen defects accumulated at the bottom channel interface, as inferred from the difference in PBTS results for the top single gate and double gate structures

ECS TransactionsVol. 114(3)
Openalex Percentile: Top 86%
Semiconductor materials and devices
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