(Invited) Selective Wet Etching of Semiconductor Materials by Novel Catalyst-assisted Modes
Since reports in the mid-1990s on metal-induced pitting on a Si surface in microelectronics, much attention has been paid to the positive use of corrosion of a semiconductor surface loaded with a metallic catalyst in solutions, known as metal-assisted chemical etching. This paper describes two novel modes of catalyst-assisted etching. The first involves the formation of nano trenches along the atomic step edges of a Si(111) surface with the help of self-assembled metallic nanowires, enabling the separation of neighboring terraces. The second discusses the science and application of nanocarbon-assisted etching, free from noble metals, of a Ge surface in water.
Authors
- Junhuan Li (ORCID: https://orcid.org/0009-0003-9856-636X)
- Kouji Inagaki
- Kenta Arima (ORCID: https://orcid.org/0000-0003-2030-8291)
- Shiika Murase
Publication Details
- Journal
- ECS Transactions
- Published
- 2024-09-27
- DOI
- https://doi.org/10.1149/11401.0017ecst
- Primary Topic
- Copper Interconnects and Reliability
- Type
- article
- Field-Weighted Citation Impact
- 0.00