Enhanced Thermoelectric Performance of p-type AgSbTe<sub>2</sub> via Cu Doping
Recently, the p-type semiconductor AgSbTe<sub>2</sub> has received a great deal of attention due to its promising thermoelectric performance in intermediate temperatures (300-700 K). However, its performance is limited by the suboptimal carrier concentration and the presence of Ag<sub>2</sub>Te impurities. Herein, we synthesized AgSb<sub>1-<i>x</i></sub>Cu<sub><i>x</i></sub>Te<sub>2</sub> (<i>x</i> = 0, 0.02, 0.04, and 0.06) and investigated the effect of Cu doping on the thermoelectric properties of AgSbTe<sub>2</sub>. Our results indicate that Cu doping suppresses the Ag<sub>2</sub>Te impurities, raises the carrier concentration, and results in an improved power factor (PF). The calculation reveals that Cu doping downshifts the Fermi energy level, reduces the energy band gap and the difference among several valence band maximums, and thereby explains the improvement of PF. In addition, Cu doping reduces the thermal conductivity, possibly attributed to the inhibition of Ag<sub>2</sub>Te impurities and the phonon softening of the AgSb<sub>1-<i>x</i></sub>Cu<sub><i>x</i></sub>Te<sub>2</sub>. Overall, Cu doping improves the <i>ZT</i> of AgSb<sub>1-<i>x</i></sub>Cu<sub><i>x</i></sub>Te<sub>2</sub>. Among all samples, AgSb<sub>0.96</sub>Cu<sub>0.04</sub>Te<sub>2</sub> has a maximum <i>ZT</i> of ∼1.45 at 498 K and an average <i>ZT</i> of ∼1.11 from 298 to 573 K.
Authors
- Jun‐Ming Liu (ORCID: https://orcid.org/0000-0001-8988-8429)
- Aijun Hong (ORCID: https://orcid.org/0000-0002-5328-8760)
- Yuxia Tang (ORCID: https://orcid.org/0000-0002-0040-6145)
- Wenjie Shu
- Z. B. Yan (ORCID: https://orcid.org/0000-0002-2306-0239)
- Lin Lin (ORCID: https://orcid.org/0000-0002-2832-7537)
- B. Su (ORCID: https://orcid.org/0009-0006-3999-8033)
- Xiaohui Zhou (ORCID: https://orcid.org/0000-0001-7907-3293)
Institutions
- Nanjing Forestry University (CN)
- Collaborative Innovation Center of Advanced Microstructures (CN)
- Jiangxi Normal University (CN)
- Nanjing University (CN)
Publication Details
- Journal
- ACS Applied Materials & Interfaces
- Published
- 2024-09-27
- DOI
- https://doi.org/10.1021/acsami.4c05454
- Citations
- 9
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 1.05
Funders
- National Natural Science Foundation of China