Numerical and experimental study of heat dissipation enhancement in high-power cabinets

This article proposes a solution to the cooling problem of high-power air-cooled server racks by designing a three-layer parallel Z-type ventilated cabinet and optimizing the heat dissipation path and structure. Through thermal simulation and experimental tests, it was found that using Z-type air ducts, static pressure chambers, and optimized heat dissipation structures in a single sub-rack can reduce the maximum temperature and the maximum temperature difference of chips by about 7°C and 2°C, respectively. After the cabinet is equipped with parallel air ducts, the maximum temperature and maximum temperature difference of chips are reduced by 7-22°C and 7-10°C, respectively, and the maximum heat dissipation capacity of the cabinet is increased from 4.6kW to 6.9kW. Additionally, the noise level of the entire cabinet is also improved due to the reduction in the number of fans.