Research on temperature cycling reliability of BGA solder ball

This paper produced tensile specimens of Sn₆₃Pb₃₇ solder and conducted uniaxial tensile tests under different temperature conditions. Through nonlinear fitting of the test parameters, the nine parameters of the Anand constitutive model were obtained, and the Anand constitutive model of the solder was constructed. Abaqus finite element software was used to simulate the creep behavior of BGA solder balls during temperature cycling, and the stress and life of the solder balls were studied. The analysis results show that the peripheral solder balls have greater stress, strain and lower lifespan. The greatest risk of fracture is at the root of the solder ball. Underfill glue can effectively improve the reliability of the solder ball.