Avoiding avalanche breakdown in planar GaN Gunn diodes by means of a substrate contact

Abstract Impact ionization originated by the buffer leakage current, together with high electric fields ( <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" overflow="scroll"> <mml:mrow> <mml:mrow> <mml:mo>&gt;</mml:mo> </mml:mrow> </mml:mrow> </mml:math> 3 MV cm −1 ) at the anode corner of the isolating trenches, has been identified as the failure mechanism of shaped planar GaN Gunn diodes when biased above 20 V, so that no evidence of Gunn oscillations in fabricated devices has been observed yet. In order to avoid the avalanche, we propose the addition of a Schottky substrate terminal, which, by means of Monte Carlo simulations, has been confirmed to be able to suppress such not-desired leakage current when applying a negative substrate bias. When the substrate bias is positive, impact ionization is also reduced due to the lower electric field at the hotspot, but a vertical cathode-substrate current degrades the device operation. In order to avoid such current, we propose the use a MIS configuration for the substrate contact, which is the optimal solution.

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Publication Details

Journal
Journal of Physics D Applied Physics
Published
2024-09-27
DOI
https://doi.org/10.1088/1361-6463/ad809f
Citations
1
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.31

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article

Avoiding avalanche breakdown in planar GaN Gunn diodes by means of a substrate contact

I. Íñiguez-de-la-Torre, J. Mateos, Marie Lesecq, B. G. Vasallo et al.
1 citations
Journal of Physics D Applied Physics
GaN-based semiconductor devices and materials
0.31
article

Avoiding avalanche breakdown in planar GaN Gunn diodes by means of a substrate contact

I. Íñiguez-de-la-Torre, J. Mateos, Marie Lesecq, B. G. Vasallo, Lili Huo, Sergio García-Sánchez, K. Radhakrishnan, Mahmoud Abou Daher, R Lingaparthi, S. Pérez, T. González, D. Nethaji
article en
1 citations

Abstract

Abstract Impact ionization originated by the buffer leakage current, together with high electric fields ( <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" overflow="scroll"> <mml:mrow> <mml:mrow> <mml:mo>&gt;</mml:mo> </mml:mrow> </mml:mrow> </mml:math> 3 MV cm −1 ) at the anode corner of the isolating trenches, has been identified as the failure mechanism of shaped planar GaN Gunn diodes when biased above 20 V, so that no evidence of Gunn oscillations in fabricated devices has been observed yet. In order to avoid the avalanche, we propose the addition of a Schottky substrate terminal, which, by means of Monte Carlo simulations, has been confirmed to be able to suppress such not-desired leakage current when applying a negative substrate bias. When the substrate bias is positive, impact ionization is also reduced due to the lower electric field at the hotspot, but a vertical cathode-substrate current degrades the device operation. In order to avoid such current, we propose the use a MIS configuration for the substrate contact, which is the optimal solution.

Journal of Physics D Applied PhysicsVol. 58(1)
Centre National de la Recherche Scientifique (FR), Nanyang Technological University (SG), Universidad de Salamanca (ES), Université de Lille (FR), Institut d'Electronique, de Microélectronique et de Nanotechnologie (FR), Council of Scientific and Industrial Research (IN), Université Polytechnique Hauts-de-France (FR), École Centrale de Lille (FR)
Universidad de Salamanca, Junta de Castilla y León, European Regional Development Fund, Agencia Estatal de Investigación
Openalex Percentile: Top 43%
GaN-based semiconductor devices and materials
0.31
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