Kinetic model for stress in sputter-deposited alloy thin films and its application to the vanadium–tungsten alloy system

The use of thin films made of alloys, i.e., containing multiple metal species, can enhance their properties. However, as with single-element films, residual stress in the films can limit their performance. A model is proposed for relating the stress in alloy thin films to the processing conditions (growth rate, temperature, and sputter-gas pressure), material properties (composition, atomic and defect mobilities, and elastic moduli), and microstructure (grain size and grain growth kinetics). The model is based on stress-generating processes that occur during film growth at grain boundaries and due to energetic particle impacts. While the equations are similar to those proposed for single-element films, the alloy kinetic parameters now contain the effects of the different atomic species. The model is used to explain the growth rate and composition dependence of in situ stress evolution during the deposition for various concentrations in the tungsten–vanadium system.