Research on Multiphysics-Driven MEMS Safety and Arming Devices

As the core component of energy transfer in weapon system, safety and arming (S&A) devices affect the safety, reliability, and damage ability of the weapon. Micro-electromechanical systems (MEMS) S&A devices have been widely investigated for their smaller structure size, higher functional integration, and better smart functionality. This paper proposes the design of a multi-physics field-driven MEMS S&A device. The S&A mechanism is composed of a setback mechanism, a spin mechanism, and an electrothermal mechanism, achieving multiphysics-arming. With the coordination of the three mechanisms, the S&A device can produce a 1 mm displacement. The displacement generated allows the S&A device to switch between safety status and arming status. The unlock conditions and overload resistance of each mechanism are obtained by finite element simulation. Based on SOI wafers and silicon oxide wafers, the chips were fabricated and packaged. Several tests were carried out to verify the working condition and overload resistance of the S&A device. The result shows that under a voltage of 11 V and a rotation speed of 8000 r/min, with a size no more than 10 mm × 10 mm × 1.5 mm, the device works smoothly and can withstand an overload of 25,000 g.

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Publication Details

Journal
Micromachines
Published
2024-09-26
DOI
https://doi.org/10.3390/mi15101194
Citations
2
Primary Topic
Advanced Optical Sensing Technologies
Type
article
Field-Weighted Citation Impact
1.01
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article

Research on Multiphysics-Driven MEMS Safety and Arming Devices

Yifei Wang, Zhongwang Tian, Yulong Zhao, Tengjiang Hu et al.
2 citations
Micromachines
Advanced Optical Sensing Technologies
1.01
article

Research on Multiphysics-Driven MEMS Safety and Arming Devices

Yifei Wang, Zhongwang Tian, Yulong Zhao, Tengjiang Hu, Wei Xue, Xinyu Fan
article en
2 citations

Abstract

As the core component of energy transfer in weapon system, safety and arming (S&A) devices affect the safety, reliability, and damage ability of the weapon. Micro-electromechanical systems (MEMS) S&A devices have been widely investigated for their smaller structure size, higher functional integration, and better smart functionality. This paper proposes the design of a multi-physics field-driven MEMS S&A device. The S&A mechanism is composed of a setback mechanism, a spin mechanism, and an electrothermal mechanism, achieving multiphysics-arming. With the coordination of the three mechanisms, the S&A device can produce a 1 mm displacement. The displacement generated allows the S&A device to switch between safety status and arming status. The unlock conditions and overload resistance of each mechanism are obtained by finite element simulation. Based on SOI wafers and silicon oxide wafers, the chips were fabricated and packaged. Several tests were carried out to verify the working condition and overload resistance of the S&A device. The result shows that under a voltage of 11 V and a rotation speed of 8000 r/min, with a size no more than 10 mm × 10 mm × 1.5 mm, the device works smoothly and can withstand an overload of 25,000 g.

MicromachinesVol. 15(10)
Guizhou Electromechanical Research and Design Institute (CN), Xi'an Aeronautical University (CN), Xi'an Jiaotong University (CN)
Openalex Percentile: Top 20%
Advanced Optical Sensing Technologies
1.01
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