A stacking sequence optimization strategy for process‐induced deformation of multi‐layer thick asymmetric laminates

Abstract The occurrence of process‐induced deformations of composites laminates is challenging for assembly accuracy and may lead to a service life reduction of parts. However, it can be obviously mitigated through different optimization strategies on the basis of the accurate curing process simulation. In this study, a stacking sequence optimization strategy is proposed and applied to multi‐layer thick asymmetric laminates. The shapes of deformed laminate plates are experimentally investigated in virtue of the three‐dimensional coordinate measuring machine. The thermo‐chemical–mechanical behaviors of plates are first verified through the comparisons of model predicted and experimental process‐induced deformations. Then the nonlinear control formula achieved through the regression model is proposed for the direct relationship between stacking sequences and process‐induced deformations. Finally, the required solutions are generated by solving the control formula. With the comparisons between the average deformations before and after optimizations, it is found that the magnitudes of deformations are significantly reduced, especially when the unoptimizated deformations are large. Highlights The thermo‐chemical–mechanical behavior can be described in the curing process simulation model. The deformed shapes of multi‐layer thick asymmetric laminate plates are measured by a three‐dimensional coordinate measuring machine. The stacking sequence optimization strategy is implemented by introducing a nonlinear control formula.

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Publication Details

Journal
Polymer Composites
Published
2024-09-16
DOI
https://doi.org/10.1002/pc.29048
Citations
3
Primary Topic
Epoxy Resin Curing Processes
Type
article
Field-Weighted Citation Impact
0.64

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article

A stacking sequence optimization strategy for process‐induced deformation of multi‐layer thick asymmetric laminates

Hongli Jia, Gang Chen, Dong Liu, Yingdan Zhu et al.
3 citations
Polymer Composites
Epoxy Resin Curing Processes
0.64
article

A stacking sequence optimization strategy for process‐induced deformation of multi‐layer thick asymmetric laminates

Hongli Jia, Gang Chen, Dong Liu, Yingdan Zhu, Chun Yan
article en
3 citations

Abstract

Abstract The occurrence of process‐induced deformations of composites laminates is challenging for assembly accuracy and may lead to a service life reduction of parts. However, it can be obviously mitigated through different optimization strategies on the basis of the accurate curing process simulation. In this study, a stacking sequence optimization strategy is proposed and applied to multi‐layer thick asymmetric laminates. The shapes of deformed laminate plates are experimentally investigated in virtue of the three‐dimensional coordinate measuring machine. The thermo‐chemical–mechanical behaviors of plates are first verified through the comparisons of model predicted and experimental process‐induced deformations. Then the nonlinear control formula achieved through the regression model is proposed for the direct relationship between stacking sequences and process‐induced deformations. Finally, the required solutions are generated by solving the control formula. With the comparisons between the average deformations before and after optimizations, it is found that the magnitudes of deformations are significantly reduced, especially when the unoptimizated deformations are large. Highlights The thermo‐chemical–mechanical behavior can be described in the curing process simulation model. The deformed shapes of multi‐layer thick asymmetric laminate plates are measured by a three‐dimensional coordinate measuring machine. The stacking sequence optimization strategy is implemented by introducing a nonlinear control formula.

Polymer CompositesVol. 46(2)
Chinese Academy of Sciences (CN), University of Chinese Academy of Sciences (CN), Ningbo Institute of Industrial Technology (CN)
National Key Research and Development Program of China
Openalex Percentile: Top 36%
Epoxy Resin Curing Processes
0.64
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