Effect of the addition of Ni and Cu on solidification microstructure evolution of Al-5Si-0.5Mg alloys

Abstract To develop new high-performance hypoeutectic Al–Si–Mg alloys at elevated temperatures, it is often necessary to add alloying elements of Cu and Ni. The high-temperature strength of the most used Al–Si–Mg–Cu–Ni alloy depends on a load transfer from the α-Al matrix to the intermetallic compounds. However, there is still a lack of detailed investigation on the effects of the combined addition of Ni and Cu on the solidification microstructure evolution of Al–Si–Mg base alloys with a lower Si concentration. This investigation specifically addresses the effects of the addition of Cu or Cu and Ni on the solidification microstructure evolution of the Al–5Si–0.5Mg alloy. It was found that when Al–5Si–0.5Mg is alloyed with Cu or Cu and Ni, the solidus temperature decreases, while the freezing range of the Al–5Si–0.5Mg alloy increases. With the addition of Cu and even small amounts of Ni, the phases Al 7 Cu 4 Ni and Al 5 Cu 2 Mg 8 Si 6 were predicted by TC simulations and also observed by SEM. With a higher Ni content, Al 3 Ni and Al 3 Ni 2 also solidify. More importantly, the presence of Cu and Ni can partition into the α-AlSiFeMn phase and change the size and morphology of the α-AlSiFeMn phase. This investigation provides a helpful hint to the development of the high-performance Al–Si–Mg–Cu–Ni alloys with a simultaneous improvement of the thermal conductivity and mechanical properties.