Elastic Modulus Measurement at High Temperatures for Miniature Ceramic Samples Using Laser Micro-Machining and Thermal Mechanical Analyzer
In this paper, we demonstrate a method of measuring the flexural elastic modulus of ceramics at an intermediate (~millimeter) scale at high temperatures. We used a picosecond laser to precisely cut microbeams from the location of interest in a bulk ceramic. They had a cross-section of approximately 100 μm × 300 μm and a length of ~1 cm. They were then tested in a thermal mechanical analyzer at room temperature, 500 °C, 800 °C, and 1100 °C using the four-point flexural testing method. We compared the elastic moduli of high-purity Al<sub>2</sub>O<sub>3</sub> and AlN measured by our method with the reported values in the literature and found that the difference was less than 5% for both materials. This paper provides a new and accurate method of characterizing the high-temperature elastic modulus of miniature samples extracted from representative/selected areas of bulk materials.
Authors
- Rajendra Kumar Bordia (ORCID: https://orcid.org/0000-0001-9256-0301)
- Hai Xiao (ORCID: https://orcid.org/0000-0003-1460-6241)
- Fei Peng (ORCID: https://orcid.org/0000-0002-3924-9028)
- Zhao Zhang (ORCID: https://orcid.org/0000-0001-8195-038X)
Institutions
- Clemson University (US)
Publication Details
- Journal
- Materials
- Published
- 2024-09-21
- DOI
- https://doi.org/10.3390/ma17184636
- Citations
- 2
- Primary Topic
- Metal and Thin Film Mechanics
- Type
- article
- Field-Weighted Citation Impact
- 0.54
Funders
- National Science Foundation
- U.S. Army