Gradient Corrosion-Resistant Copper Using Molecular Decomposable Ink from Recycling

Oxidation and corrosion present significant challenges for copper in critical applications such as electronics. Graphene-like carbon materials hold promise for preventing oxidation and corrosion, but their application to metallic surfaces is hindered by a complex immobilization process. Herein, we describe copper-based molecular decomposable inks derived from recycling which enable in situ conversion to form a copper─graphitic carbon hierarchical structure. This structure withstands severe corrosive and oxidative environments and maintains stable performance across a wide temperature range, from cryogenic (−193 °C) to high temperature (500 °C) conditions. The graphitic carbon shell acts as an effective barrier, preventing oxidation and corrosion by creating lengthy diffusion routes within the hierarchical copper matrix. This enables the reliable operation of a printed antenna under a corrosive environment in a reliable fashion. The results show that the copper with a graphitic carbon shell has excellent oxidation and corrosion resistance capabilities, and the findings can be expanded to establish printed molecular decomposable materials as a platform for rapid prototyping of anticorrosion and antioxidation electronics suitable for different environmental conditions.

Authors

Institutions

Publication Details

Journal
ACS Applied Electronic Materials
Published
2024-09-16
DOI
https://doi.org/10.1021/acsaelm.4c01259
Primary Topic
Recycling and Waste Management Techniques
Type
article
Field-Weighted Citation Impact
0.00

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Gradient Corrosion-Resistant Copper Using Molecular Decomposable Ink from Recycling

Abdullah Islam, Jian Yu, Zhongxuan Wang, Shenqiang Ren et al.
1 links
ACS Applied Electronic Materials
Recycling and Waste Management Techniques
article

Gradient Corrosion-Resistant Copper Using Molecular Decomposable Ink from Recycling

Abdullah Islam, Jian Yu, Zhongxuan Wang, Shenqiang Ren, Thomas Parker, Saurabh Khuje, Jun Zhang, Long Zhu
article en

Abstract

Oxidation and corrosion present significant challenges for copper in critical applications such as electronics. Graphene-like carbon materials hold promise for preventing oxidation and corrosion, but their application to metallic surfaces is hindered by a complex immobilization process. Herein, we describe copper-based molecular decomposable inks derived from recycling which enable in situ conversion to form a copper─graphitic carbon hierarchical structure. This structure withstands severe corrosive and oxidative environments and maintains stable performance across a wide temperature range, from cryogenic (−193 °C) to high temperature (500 °C) conditions. The graphitic carbon shell acts as an effective barrier, preventing oxidation and corrosion by creating lengthy diffusion routes within the hierarchical copper matrix. This enables the reliable operation of a printed antenna under a corrosive environment in a reliable fashion. The results show that the copper with a graphitic carbon shell has excellent oxidation and corrosion resistance capabilities, and the findings can be expanded to establish printed molecular decomposable materials as a platform for rapid prototyping of anticorrosion and antioxidation electronics suitable for different environmental conditions.

ACS Applied Electronic Materials
DEVCOM Army Research Laboratory (US), United States Army Combat Capabilities Development Command (US), University of Maryland, College Park (US)
Army Research Laboratory
Openalex Percentile: Top 81%
Recycling and Waste Management Techniques
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.