Gradient Corrosion-Resistant Copper Using Molecular Decomposable Ink from Recycling
Oxidation and corrosion present significant challenges for copper in critical applications such as electronics. Graphene-like carbon materials hold promise for preventing oxidation and corrosion, but their application to metallic surfaces is hindered by a complex immobilization process. Herein, we describe copper-based molecular decomposable inks derived from recycling which enable in situ conversion to form a copper─graphitic carbon hierarchical structure. This structure withstands severe corrosive and oxidative environments and maintains stable performance across a wide temperature range, from cryogenic (−193 °C) to high temperature (500 °C) conditions. The graphitic carbon shell acts as an effective barrier, preventing oxidation and corrosion by creating lengthy diffusion routes within the hierarchical copper matrix. This enables the reliable operation of a printed antenna under a corrosive environment in a reliable fashion. The results show that the copper with a graphitic carbon shell has excellent oxidation and corrosion resistance capabilities, and the findings can be expanded to establish printed molecular decomposable materials as a platform for rapid prototyping of anticorrosion and antioxidation electronics suitable for different environmental conditions.
Authors
- Abdullah Islam (ORCID: https://orcid.org/0009-0005-3398-6907)
- Jian Yu (ORCID: https://orcid.org/0000-0002-1681-4602)
- Zhongxuan Wang (ORCID: https://orcid.org/0000-0003-1664-4639)
- Shenqiang Ren (ORCID: https://orcid.org/0000-0002-9987-3316)
- Thomas Parker (ORCID: https://orcid.org/0000-0002-6151-6815)
- Saurabh Khuje (ORCID: https://orcid.org/0000-0002-7037-859X)
- Jun Zhang (ORCID: https://orcid.org/0000-0003-4824-092X)
- Long Zhu (ORCID: https://orcid.org/0000-0001-7146-9816)
Institutions
- DEVCOM Army Research Laboratory (US)
- United States Army Combat Capabilities Development Command (US)
- University of Maryland, College Park (US)
Publication Details
- Journal
- ACS Applied Electronic Materials
- Published
- 2024-09-16
- DOI
- https://doi.org/10.1021/acsaelm.4c01259
- Primary Topic
- Recycling and Waste Management Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Army Research Laboratory