Enabling IoT with Powerful Edge Node Devices

This presentation discusses how advancements in integration and packaging technologies can facilitate the creation of powerful edge node devices for Internet of Things (IoT) applications. These devices integrate analog, digital, and silicon photonics into a single unit, resulting in compact yet powerful computing devices with high energy efficiency. The use of System-in-Package (SiP) or Heterogenous Integration (HI) enables the development of compact products around these optimized devices. This presentation envisions non-digital technologies like sensors, power management, silicon photonics, and radio frequency components, envisioning a future where such devices become more prevalent, accessible, and innovative. The technology and design innovations aim to make these advancements accessible to all, fostering the continued development of smaller, cost-effective, and innovative products.