Development of 808 nm Laser-Assisted-Bonding (LAB) for Photonic System-in-Package Integration

We describe a versatile laser-assisted bonding (LAB) system for photonic system-in-package integration using an 808 nm laser. This paper details the LAB process for flip chip bonding of Si and InP PICs onto glass interposers.

Authors

Kevin Shortiss (ORCID: https://orcid.org/0000-0002-5249-7034)
Moritz Seyfried
Peter O’Brien (ORCID: https://orcid.org/0000-0003-3184-3759)
How Yuan Hwang (ORCID: https://orcid.org/0000-0002-8536-0974)
Josué Parra-Cetina (ORCID: https://orcid.org/0000-0002-6813-4545)

Institutions

International Energy Research Centre (IE)

Publication Details

Published: 2024-08-04
DOI: https://doi.org/10.1109/cleo-pr60912.2024.10676851
Primary Topic: 3D IC and TSV technologies
Type: article
Field-Weighted Citation Impact: 0.00

Controls

|||

ALL TIME

JAN

FEB

MAR

APR

MAY

JUN

JUL

AUG

SEP

OCT

article

Development of 808 nm Laser-Assisted-Bonding (LAB) for Photonic System-in-Package Integration

Kevin Shortiss, Moritz Seyfried, Peter O’Brien, How Yuan Hwang et al.

Aug 4, 2024

3D IC and TSV technologies

article

Development of 808 nm Laser-Assisted-Bonding (LAB) for Photonic System-in-Package Integration

Kevin Shortiss, Moritz Seyfried, Peter O’Brien, How Yuan Hwang, Josué Parra-Cetina

August 4, 2024article en

Abstract

We describe a versatile laser-assisted bonding (LAB) system for photonic system-in-package integration using an 808 nm laser. This paper details the LAB process for flip chip bonding of Si and InP PICs onto glass interposers.

International Energy Research Centre (IE)

Openalex Percentile: Top 87%

3D IC and TSV technologies

DOI Source OpenAlex

AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Development of 808 nm Laser-Assisted-Bonding (LAB) for Photonic System-in-Package Integration — Kevin Shortiss, Moritz Seyfried, et al. · (2024) | TGRS Research Map | TGRS