Study on process optimization of electroless Ni-P plating on binderless WC

Abstract In the field of Precision Glass Molding (PGM), binderless tungsten carbide (WC) is a pivotal material for molds, despite its high processing costs and complexities. Nickel-phosphorus (Ni-P) alloys also exhibit superior performance at elevated temperatures. The innovation of Ni-P/WC composite molds addresses the issue of the poor machinability of WC. This research delves into the influence of the activating solution’s concentration on the surface activation energy of WC, the quality of plating, and the deposition rate during the electroless Ni-P plating process. Additionally, the study scrutinizes how the pH level of the plating solution impacts the quality of Ni-P, the rate of deposition, and the phosphorus content. These investigations have led to the realization of an efficient and high-quality Ni-P plating process for WC.