Mechanical Robustness Analysis of Semiconductors with a Single Needle Probe Card Using Acoustic Emissions

The combination of indentation testing and acoustic emission (AE) is widely used to analyze the fracture toughness of test substrates. In the manufacturing of semiconductor devices this material parameter also plays an important role. During the so-called wafer testing inside a wafer prober small probe tips are pressed onto the chip surface to check its performance. To prevent damaging the chip by that, the fracture toughness and load limit of it has to be defined in a prequalification step. This paper presents a test system that imitates the wafer testing process as close as possible and uses acoustic emission to detect appearing cracks and thereby also the load limit. The frontend of the test setup consists of a modular single needle probe card which can be placed in a wafer prober. Also, the indenter properties (tip diameter, stiffness, etc.) can be adjusted to the probe used later on during productive wafer testing to ensure realistic probing conditions. A piezoelectric sensor and a full strain gauge Wheatstone bridge are implemented close to the single indenter to measure the AEs and the applied contact force respectively. The signal-to-noise-ratios (SNRs) of both sensors are improved with an own analog amplifier module before recording them with an USB oscilloscope. A developed measurement software (LabVIEW) is used to adjust measurement parameters (trigger limit, record length, conversion factors, etc.) and automatically store and separate measurement data from different acoustic events and imprints. To evaluate the result files a second software tool (MATLAB) reads the files out and clusters the recorded events to separate crack signals from electrical and mechanical disturbances. With a prototype first test results are generated and the functionality and accuracy of the measurement concept is proven.