Advanced Packaging, Heterogeneous Integration, and Foundry 2.0

The invention of the system-on-chip (SoC) was a huge leap forward from the standard semiconductor circuit board. Today the industry sees another leap forward: advanced packaging (AP). This paradigm shift in yield and performance enables affordable customization, true heterogeneous integration (HI), and a new manufacturing model: Foundry 2.0.

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Publication Details

Published
2024-08-11
DOI
https://doi.org/10.1109/mwscas60917.2024.10658948
Primary Topic
3D IC and TSV technologies
Type
article
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article

Advanced Packaging, Heterogeneous Integration, and Foundry 2.0

Robert Patti
3D IC and TSV technologies
article

Advanced Packaging, Heterogeneous Integration, and Foundry 2.0

Robert Patti
article en

Abstract

The invention of the system-on-chip (SoC) was a huge leap forward from the standard semiconductor circuit board. Today the industry sees another leap forward: advanced packaging (AP). This paradigm shift in yield and performance enables affordable customization, true heterogeneous integration (HI), and a new manufacturing model: Foundry 2.0.

NHanced Semiconductors (United States) (US)
Openalex Percentile: Top 87%
3D IC and TSV technologies
DOISourceOpenAlex
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Advanced Packaging, Heterogeneous Integration, and Foundry 2.0 — Robert Patti · (2024) | TGRS Research Map | TGRS