Co-Design for Heterogeneous Integration: High Level Decisions to the Rescue
The impact of informed high level decisions on the performance-power efficiency of semiconductors is well known. From the context of heterogeneous integration for 3D IC, new innovations are needed which close the loop from architecture to device; from multiphysics to high level abstraction; from performance to security. Such considerations will be presented.
Authors
- Abir Akib (ORCID: https://orcid.org/0000-0002-1455-6662)
- Daniel Xing (ORCID: https://orcid.org/0000-0003-3661-746X)
- Ankur Srivastava (ORCID: https://orcid.org/0000-0002-5445-904X)
- Yuntao Liu (ORCID: https://orcid.org/0000-0001-8213-582X)
Institutions
- University of Maryland, College Park (US)
Publication Details
- Published
- 2024-08-11
- DOI
- https://doi.org/10.1109/mwscas60917.2024.10658875
- Primary Topic
- Interconnection Networks and Systems
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Science Foundation