Electroless Deposition for Robust and Uniform Copper Nanoparticles on Electrospun Polyacrylonitrile (PAN) Microfiltration Membranes

Filtration membranes coated in metals such as copper have dramatically improved biofouling resistance and pathogen destruction. However, existing coating methods on polymer membranes impair membrane performance, lack uniformity, and may detach from their substrate, thus contaminating the permeate. To solve these challenges, we developed the first electroless deposition protocol to immobilize copper nanoparticles on electrospun polyacrylonitrile (PAN) fibers for the design of antimicrobial membranes. The deposition was facilitated by prior silver seeding. Distinct mats with average fiber diameters of 232 ± 36 nm, 727 ± 148 nm and 1017 ± 80 nm were evaluated for filtration performance. Well-dispersed copper nanoparticles were conformal to the fibers, preserving the open-cell architecture of the membranes. The copper particle sizes ranged from 20 to 140 nm. Infrared spectroscopy revealed the PAN fiber mats' relative chemical stability/resistance to the copper metallization process. In addition, the classical cyclization of the cyano functional group in PAN was observed. For model polystyrene beads with average sizes of 3 μm, Cu NP-PAN fiber mats had high water flux and separation efficiency with negligible loss of Cu NP from the fibers during flow testing. Fiber size increased flux and somewhat decreased separation efficiency, though the efficiency values were still high.