Damage Mechanism of Subsurface of FeCoNiCrAl High-Entropy Alloys Based on Molecular Dynamics Simulation Under Different Temperature

This study investigates how thermal conditions affect the nanomachining of FeCoNiCrAl high-entropy alloys, using molecular dynamics simulations at 100[Formula: see text]K, 150[Formula: see text]K and 200[Formula: see text]K. Key findings include a direct relationship between stress intensification and machining velocity at all temperatures, with stress concentrating at intergranular boundaries. At subsonic speeds ([Formula: see text]200[Formula: see text]m/s), stress inversely correlates with temperature, while at supersonic speeds ([Formula: see text]200[Formula: see text]m/s), stress increases with temperature. Incremental cutting depths affect chip morphology, with chips at 150[Formula: see text]K being 1.38 times thicker than at 200K. Minimum machining forces were 94.5[Formula: see text]Nn, 101.2[Formula: see text]Nn and 92.5Nn along [100], and 87.3[Formula: see text]Nn, 85.3[Formula: see text]Nn and 86.1[Formula: see text]Nn along [001]. Dislocation densities showed higher values at lower temperatures, with peak 1/2 [Formula: see text] densities at 100[Formula: see text]K being 1.43 and 1.45 times greater than at 150[Formula: see text]K and 200[Formula: see text]K, respectively.