Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition

• Atomized Ag-20 wt%Si and Ag-50 wt%Si particles are fabricated and added to Ag paste. • The CTE reduction intensifies with increasing Ag-Si particle content. • Both microstructure and shear strength were improved with increasing Ag-Si particle content. • The retention ratio of shear strength of AS20-30 after 1000 cycles was 102.3%. • Optimized prominent die attach materials for power electronics are obtained. In this study, two kinds of atomized Ag-20 wt%Si and Ag-50 wt%Si particles are fabricated and added to Ag paste to fabricate composite pastes to achieve a low coefficient of thermal expansion (CTE), and their performance stability in SiC power module is evaluated under thermal shock from −50 to 250 °C. Four kinds of composite Ag pastes using the two kinds of atomized Ag-Si addition with 10 % and 30 % were obtained, AS20-10, AS50-10, AS20-30 and AS50-30, respectively. The results show that the CTE reduction intensifies with increasing Ag-Si atomized particle content. The retention ratio of shear strength of AS20-30 sintered joint after 1000 cycles was 102.3 %, which means the shear strength did not decrease during so harsh thermal shock test. The mechanism was discussed in detail. In addition, the properties such as thermal conductivity and electrical conductivity for the composite pastes were also evaluated to gain a more comprehensive understanding for the new materials especially for the design of SiC power modules with a long-time life. Comprehensively considering the material parameters of the composite pastes and the reliability of the sintered joints under thermal shock, the optimized composite pastes as die attach material in power electronics are obtained. The findings should be inspiring in developing novel die attach materials for high reliable interconnections in SiC power modules.