2D Computational Fluid Dynamics Simulation Analysis of the Assembly of Low‐Temperature Cofired Ceramics/Low‐Temperature Cofired Ceramics and Si/Si Sandwiches by Reactive Bonding

Numerical computational fluid dynamics simulations have been performed on 2D sandwich models to compare the performance of low‐temperature cofired ceramics (LTCC)/LTCC and Si/Si sandwiches used in reactive bonding. In the sandwich model layers of solder, silver and a reactive multilayer used to bond the substrates are modeled. Additional to this, the surrounding air environment is also modeled. For simulating the heat released by the multilayer system, a user‐defined function in the form of a square wave is written for the heat source with a defined width, corresponding to the reaction width, and this propagates at a fixed speed. Two sandwiches, one with LTCC/LTCC, and the other with Si/Si, are simulated and their response analyzed in terms of the solidification/melting of the solder and their respective time–temperature histories.