Investigating the Influence of Surface Roughness on Metal Bonding Using Response Surface Methodology

The present study deals with the parameters for Stainless Steel 304 and Aluminum 5083 optimized with an emphasis on surface roughness, cure time, and their impact on the tensile strength of single-lap shear joints. Utilizing a central composite design, the effects of these factors were examined. Acetone was used to polish the surfaces, and silicon carbide sheets (P30, P36, and P60) were used to abrade them. Utilizing Henkel Loctite HY4090 glue, testing was conducted in accordance with ASTM D1002 guidelines. The variables were optimized with Design-Expert 11. Maximum tensile strengths were obtained with P30 abrasion and a 48-h cure time for SS304 (Ra = 3.2 µm) and Al5083 (Ra = 5 µm), respectively.

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Published
2024-09-19
DOI
https://doi.org/10.3390/engproc2024075002
Citations
1
Primary Topic
Electronic Packaging and Soldering Technologies
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article
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article

Investigating the Influence of Surface Roughness on Metal Bonding Using Response Surface Methodology

Muhammad Anwar, Talha Irfan Khan, Muhammad Shaban, Mubashir Ali Murtaza
1 citations
Electronic Packaging and Soldering Technologies
0.21
article

Investigating the Influence of Surface Roughness on Metal Bonding Using Response Surface Methodology

Muhammad Anwar, Talha Irfan Khan, Muhammad Shaban, Mubashir Ali Murtaza
article en
1 citations

Abstract

The present study deals with the parameters for Stainless Steel 304 and Aluminum 5083 optimized with an emphasis on surface roughness, cure time, and their impact on the tensile strength of single-lap shear joints. Utilizing a central composite design, the effects of these factors were examined. Acetone was used to polish the surfaces, and silicon carbide sheets (P30, P36, and P60) were used to abrade them. Utilizing Henkel Loctite HY4090 glue, testing was conducted in accordance with ASTM D1002 guidelines. The variables were optimized with Design-Expert 11. Maximum tensile strengths were obtained with P30 abrasion and a 48-h cure time for SS304 (Ra = 3.2 µm) and Al5083 (Ra = 5 µm), respectively.

Institute of Space Technology (PK), National University of Technology (PK)
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Openalex Percentile: Top 48%
Electronic Packaging and Soldering Technologies
0.21
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