Smaller Bond Pad for Device Reliability

The reliability of smaller scribe line & bond pads has been evaluated in this work to improve cost-efficiency from lesser wafer space consumption. Both fully automatic probers with probe cards and semi-auto probers with micro positioners have been analyzed. Two cantilever types of probe cards have been assessed. Various reliability test method [10,11] with Wafer Level Reliability have been assessed for transistor, capacitor, and metal lines. The wafer level probing was conducted on probe chuck at room temperature, 150°C and 175°C. The bondability with smaller bond pads was collaborated with two external assembly houses using ceramic dual-line package. Wire Bond Shear [12] and Wire Bond Pull [13] tests have been carried out to check the reliability of bonding. Package Level Reliability Electromigration and Time Dependent Dielectric Breakdown tests have been executed at 220°C and 175°C to confirm the reliability impact from smaller bond pads.