Leakage current in GaN-on-GaN vertical GaN SBDs grown by HVPE on native GaN substrates
This study investigates leakage mechanisms in vertical GaN-on-GaN Schottky barrier diodes (SBDs) and demonstrates effective mitigation strategies. The fabricated devices exhibit low reverse leakage current (1 × 10−5 A/cm2 at −200 V) and a high Ion/Ioff ratio (∼1010), surpassing the performance of GaN SBDs on foreign substrates. We elucidate dominant leakage mechanisms—thermionic emission, Poole–Frenkel emission, and variable-range hopping—and their evolution with temperature and bias. Optimized fabrication processes, including defect etching and a novel dual-layer passivation technique, achieve over a 1000-fold reduction in leakage current.
Authors
- Ke Xu
- Qizhi Zhu
- Songyuan Xia (ORCID: https://orcid.org/0000-0002-9012-8563)
- Jianfeng Wang (ORCID: https://orcid.org/0000-0002-4407-4891)
- Yumin Zhang (ORCID: https://orcid.org/0000-0003-3384-6208)
- Yuanhang Sun
- Weiyi Jin (ORCID: https://orcid.org/0009-0005-6677-3422)
- Juemin Yi (ORCID: https://orcid.org/0000-0003-3239-676X)
Institutions
- University of Science and Technology of China (CN)
- Chinese Academy of Sciences (CN)
- Suzhou Institute of Nano-tech and Nano-bionics (CN)
Publication Details
- Journal
- AIP Advances
- Published
- 2024-09-01
- DOI
- https://doi.org/10.1063/5.0208706
- Citations
- 2
- Primary Topic
- GaN-based semiconductor devices and materials
- Type
- article
- Field-Weighted Citation Impact
- 0.62
Funders
- National Natural Science Foundation of China
- National Key Research and Development Program of China