Architectural Exploration for Waferscale Switching System

With the end of Moore’s law and Dennard scaling, waferscale systems or processors that integrate multiple pre-tested known good dies (KGDs) on a waferscale-interposer are new approaches to further improve the chiplet-based system’s performance. This article explores the network on wafer (NoW) architecture of waferscale switching system under several physical constraints. A software-based approach is proposed to redefine the topological property. A five-level butterfly fat-tree (BFT)-like logical topology with 8.96-Tb/s (896 ports <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\times 10$ </tex-math></inline-formula> Gb/s/port) switching bandwidth is achieved based on 2-D-mesh-like physical topology. We show that the proposed BFT-like topology with breadth-first-search (BFS) based traffic balanced routing algorithm reduces 55.6% hops, 41.4% transmission delay, and improves 24.2% throughput compared to 2-D-mesh-like topology under different traffic distributions. This BFT-like waferscale switching system is suitable for high-performance computing and data centers. In addition, the numerical analysis shows that the waferscale package can provide significant power efficiency and latency advantages compared to the typical single-chip package, which mainly benefits from the short-reach IO requirements. Note that the proposed waferscale switching system is compatible with high-switch-capacity dies with advanced process technology, which can further improve system performance. Finally, we present the physical implementations for the waferscale system with heterogeneous dies.

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Publication Details

Journal
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Published
2024-09-17
DOI
https://doi.org/10.1109/tvlsi.2024.3455332
Citations
5
Primary Topic
Semiconductor Lasers and Optical Devices
Type
article
Field-Weighted Citation Impact
1.04

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article

Architectural Exploration for Waferscale Switching System

Guandong Liu, Shunbin Li, Qinrang Liu, Zhipeng Cao et al.
5 citations
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Semiconductor Lasers and Optical Devices
1.04
article

Architectural Exploration for Waferscale Switching System

Guandong Liu, Shunbin Li, Qinrang Liu, Zhipeng Cao, Zhiquan Wan, Peijie Li, Ruyun Zhang, Qingwen Deng, Weihao Wang, Kun Zhang
article en
5 citations

Abstract

With the end of Moore’s law and Dennard scaling, waferscale systems or processors that integrate multiple pre-tested known good dies (KGDs) on a waferscale-interposer are new approaches to further improve the chiplet-based system’s performance. This article explores the network on wafer (NoW) architecture of waferscale switching system under several physical constraints. A software-based approach is proposed to redefine the topological property. A five-level butterfly fat-tree (BFT)-like logical topology with 8.96-Tb/s (896 ports <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\times 10$ </tex-math></inline-formula> Gb/s/port) switching bandwidth is achieved based on 2-D-mesh-like physical topology. We show that the proposed BFT-like topology with breadth-first-search (BFS) based traffic balanced routing algorithm reduces 55.6% hops, 41.4% transmission delay, and improves 24.2% throughput compared to 2-D-mesh-like topology under different traffic distributions. This BFT-like waferscale switching system is suitable for high-performance computing and data centers. In addition, the numerical analysis shows that the waferscale package can provide significant power efficiency and latency advantages compared to the typical single-chip package, which mainly benefits from the short-reach IO requirements. Note that the proposed waferscale switching system is compatible with high-switch-capacity dies with advanced process technology, which can further improve system performance. Finally, we present the physical implementations for the waferscale system with heterogeneous dies.

IEEE Transactions on Very Large Scale Integration (VLSI) SystemsVol. 33(2)
PLA Information Engineering University (CN), Zhejiang Lab (CN)
National Natural Science Foundation of China, National Key Research and Development Program of China
Sustainable cities and communities
Openalex Percentile: Top 23%
Semiconductor Lasers and Optical Devices
1.04
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